Physics of failure (POF) provides an approach to understanding the interaction, or physics, between a product’s materials within specific use environments. ASENT’s Board Manager and Reliability Manager expedite POF-type thermal analysis, allowing the user to quickly assess the failure rate sensitivity to a given operating temperature or range.
ASENT allows one to perform several tradeoff studies by varying package style/technology, printed wiring board (PWB) composition, part placement, and cooling design. Using ASENT, the user is able to identify or validate thermal-related problems, and identify and quantify potential solutions. One can quickly see the results of their solutions with ASENT’s PWB display tool, which graphically shows information related to failure rate, power consumption, or temperature (case, junction, layer, and substrate).
The ASENT team is also a charter member of the University of Maryland’s Computer Aided Life Cycle Engineering (CALCE) Electronic Products and Systems Center (EPSC) which is pioneering POF-based reliability assessment. They are committed to upgrading ASENT to take advantage of POF knowledge and respond to the customers’ reliability analysis needs.