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Physics of
failure (POF) provides an approach to understanding the
interaction, or physics, between a product's materials within
specific use environments. ASENT's Board Manager and Reliability
Manager expedite POF-type thermal analysis, allowing the user to
quickly assess the failure rate sensitivity to a given operating
temperature or range.
ASENT allows one to perform several tradeoff studies by
varying package style/technology, printed wiring board (PWB)
composition, part placement, and cooling design. Using ASENT, the
user is able to identify or validate thermal-related problems, and
identify and quantify potential solutions. One can quickly see the
results of their solutions with ASENT's PWB display tool, which
graphically shows information related to failure rate, power
consumption, or temperature (case, junction, layer, and
substrate).
The ASENT team
is also a charter member of the University of Maryland's Computer
Aided Life Cycle Engineering (CALCE) Electronic Products and
Systems Center (EPSC) which is pioneering POF-based reliability
assessment. They are committed to upgrading ASENT to take
advantage of POF knowledge and respond to the customers'
reliability analysis needs.
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